Zhang, Z. M., Enikov, E. T., & Makansi, T. (2011). Near-field radiative transfer between heavily doped SiGe at elevated temperatures. ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011, 10(PARTS A AND B), 283-291.
Abstract:
SiGe alloys represent an important type of high-temperature semiconductor material for solid-state energy conversion. In the present study, the near-field radiative heat transfer between heavily doped SiGe plates is investigated. A dielectric function model is formulated based on the previously reported room-temperature mobility and temperature-dependent electric resistivity of several silicon-rich alloys with different doping type and concentration. The fluctuational electrodynamics is used to evaluate the near-field noncontact heat transfer coefficient. The variation of the heat transfer coefficient with doping concentration and temperature is explained according to the change in the optical constants and in the spectral distribution of the near-field heat flux. Copyright © 2011 by ASME.
Szabo, Z., & Enikov, E. T. (2017). DEVELOPMENT OF HAPTIC COMMUNICATION DEVICE FOR DISABLED PERSONS. PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 14.
Enikov, E. T., & Boyd, J. G. (2000). Electroplated electro-fluidic interconnects for chemical sensors. Sensors and Actuators, A: Physical, 84(1), 161-164.
Abstract:
A wet chip electro-fluidic packaging technology based on electroplating is described. An electroplated gold seal provides the sensor's fluid connection to a silicon multi-chip module. A hermetic seal is obtained using the gold-silicon eutectic bond. The sensor's electrical connections to the multi-chip module are made by eutectic bonding electroplated gold-tin solder bumps on the sensor to gold pads on the substrate. The fluid and electrical connections are made simultaneously, and the process is compatible with the flip-chip bonding technique.
Enikov, E. T., & Nelson, B. J. (2000). Electrotransport and deformation model of ion exchange membrane based actuators. Proceedings of SPIE - The International Society for Optical Engineering, 3987, 129-139.
Abstract:
A continuum mechanical model of Nafion based metal-polymer actuators is presented. Global integral postulates are written for the conservation of mass, momentum, energy, and charge, Gauss' law, and the second law of thermodynamics. The global equations are then localized in the volume and on the material surfaces bounding the polymer. A finite element formulation is used to predict the evolution of the counter ion concentration, 'free' water content, electric potential, and stress/strain during actuation. The model includes stress relaxation phenomena due to water flow governed by Darcy's law.
Rose, S. E., Jones, J. F., & Enikov, E. T. (2005). Development of a high sensitivity three-axis force/torque sensor for microassembly. American Society of Mechanical Engineers, Micro-Electro Mechanical Systems Division, (Publications) MEMS, 7 MEMS, 405-409.
Abstract:
There is a growing need for multi-axis force torque (F/T) sensors to aid in the assembly of micro-scale devices. Many current generation robotic microassembly systems lack the force-feedback needed to facilitate automating common assembly tasks, such as peg-in-hole insertions. Currently, most microassembly operations use vision systems to align components being assembled. However, it is difficult to view high aspect ratio component assemblies under high magnification due to the resulting limited depth-of-field. In addition, this difficulty is compounded as assembly tolerances approach dimensions resolvable with optics or if the mating parts are delicate. This paper describes the development of a high sensitivity F/T sensor. Optimal design theory was applied to determine the configuration that would result in the most sensitive and accurate sensor: Calibration experiments demonstrated that the sensor can resolve down to 200μN and possibly less. Copyright © 2005 by ASME.
